The DINO Award is one of AMUG’s most prestigious honors. It is bestowed upon those with the highest levels of additive manufacturing expertise and a willingness to share that knowledge through contributions to AMUG, its members and the industry it represents.
The additive manufacturing industry is filled with innovative, dedicated and passionate individuals that contribute to the additive manufacturing industry and to AMUG.
Each year, the DINO Selection Committee reviews submitted nominations and the list of conference registrants to select no more than 10 deserving individuals. The committee considers contributions to AMUG (speaker, volunteer, etc.); contributions to the AM industry; years of hands-on work with an AM technology; willingness to share and assist; skill level; and other subjective factors.
Do you or someone you know have what it takes to be named a DINO? For details and a link for submissions of nominations, visit DINO Selection.
The Additive Manufacturing Users Group welcomed 6 new DINOs in 2026. The 2026 DINOs — Olga (Dr. O) Ivanova, Daniel Landgraf, Brian Post, Chris Prue, John Thiell and Annie Wang— were presented with the award on the main stage of the 2026 AMUG Conference.
The new DINOs’ efforts have played varied roles in making the AMUG Conference a positive experience for those seeking insights, information, and connections. Over many years, they have supported AMUG by being team members on the AMUG Board and AMUG committees and by supporting the AMUG Conference program.
New DINOs (from left): Chris Prue, Brian Post, Annie Wang, Olga (Dr. O) Ivanova, Daniel Landgraf and John Thiell.
Over its long history, AMUG has awarded DINOs to only 203 individuals. Although there are many deserving of recognition as a DINO, AMUG limits this prestigious award to no more than ten individuals each year.
Olga (Dr. O) Ivanova, Mechnano
Daniel Landgraf, 3D Spark
Brian Post, Oak Ridge National Laboratory
Chris Prue, IperionX
John Thiell, Beehive Industries
Annie Wang, Senvol
Amy Alexander, Mayo Clinic
Dan Braley, Boeing Global Services
Partick Gannon, Ricoh USA, Inc.
Ryan Kircher, rms Company
Dallas Martin, Toyota
Brennon White, General Motors
Jamie Cone, BD
Steve Grundahl, Prototek
Thomas Murphy, New Jersey Innovation Institute – COMET
Vadim Pikhovich, MAGMA Foundry Technologies
Bob Renella, GoEngineer
Tim Bell, MELD Manufacturing Corporation
Bogdan Filipkoswki, Custom Prototypes Inc.
Rob Hassold, Cimquest, Inc.
Danny Levy, Influit Energy
Matthew Mitchell, Yazaki North America
Heather Natal, GoEngineer
Roger Nielsen, In’Tech Industries
Dave Rittmeyer, Mathews International
Colton Rooney, EMI Corp.
Alex Roschli, Oak Ridge National Laboratory
Ben Arnold, Massivit 3D
Nick Licari, Computer Aided Technology
Matthew Donovan, Vulcan Form
Shane Collins, ASTM International
Giles Gaskell, Hexagon
Ana Neves, RAMCO
Robin Van Bragt, Eagle Design and Technology Inc.
Jeff DeGrange, Impossible Objects Inc
Bob Diaz, College of Southern Nevada
Leslie Frost, GE Additive
Youping Gao, Castheon
Ed Graham, ProtoCAM
Paul Hojan, Christie Digital
Evan Kirby, Materialise
Ulf Lindhe, Oqton, Inc.
Dana McCallum, Carbon, Inc.
Bob Wood, ExOne
Brett Charlton, BD
Jay Dinsmore, Dinsmore Associates
Rory Jackson, RAMP Inc.
Brett Lyons, Jabil Additive
Bob Markley, 3rd Dimension Industrial 3D Printing
Rick Moore, U.S. Army
Jeremy Pullin, Sartorius Stedim
Nate Schumaker, Midwest Prototyping
Tuan Tranpham, Desktop Metal
Jordan Weston, Milwaukee School of Engineering
Andy Christensen, Somaden LLC
Rey Chu, PADT, Inc.
Douglas Greenwood, Fleet Readiness Center East
Steve Hanna, 3D Systems
Rick Pressley, Renaissance Services, Inc.
Andrew Sliwa, Custom Prototypes Inc.
Fried Vancraen, Materialise
Pat Warner, Renault Sport Formula One
Ted Anderson, GE Additive
Bruce Bradshaw, Arcam AB
Carl Deckard, Structured Polymers
Joerg Griessbach, The SL Pro
Jim Harrison, The Solid Experts
Kim Killoran, Stratasys
Peter Liacouras, Walter Reed Military Medical Center
Steve Murray, Hoosier Pattern
Shannon VanDeren, Layered Manufacturing and Consulting
Kevin Zaras, DSM Functional Materials
Andrew Allshorn, At 3D-Squared, Ltd.
Ben Dolan, UC Irvine
Vito Gervasi, Milwaukee School of Engineering
Elizabeth Goode, GoodeInk
Mike Hascher, Eagle Engineered Solutions Inc.
Joe Holland, Hyphen
Bonnie Meyer, Stratasys
Todd Reese, Realize, Inc.
Dan Welker, Yazaki North America
Jack Ziemba, Aristo-Cast, Inc.
Vince Anewenter, Milwaukee School of Engineering (MSoE)
Derek Ellis, Computer Aided Technology, Inc.
Andrew Graves, Stratasys Direct Manufacturing
Steven Kossett, Natural Resources Research Institute, UMN
Stefan Ritt, SLM Solutions
Harold Sears, Ford Motor Company
Ed Tackett, University of California, Irvine
Mark Wynn, Yazaki North America
Mark Barfoot, Hyphen
Scott Crump, Stratasys
Stewart Davis, CRP USA
Jason Dickman, American Precision Prototyping
Jim Reitz, Rapid Tech Consulting
Chuck Alexander, Solid Concepts
Brian Bauman, Linked In 3D
Paul Bordner, Laser Reproductions
Todd Grimm, T.A. Grimm & Associates
Terry Hoppe, Stratasys
Paul Bates, Reebok
David Bourell, University of Texas
Bill Braune, Met-L-Flo
Duane Byerly, Xerox
Robert Coleman, Mattell
Roger Cunningham, Integra
Mike Littrell, Cideas Inc.
Jason Lopes, Legacy Effects
Frank Medina, Univ. of Texas El Paso
Dan Mishek, Vista Technologies
Larry Monahan, Becton Dickinson
Charlie Norton, NCP Leasing
Ken Patton, RapidTech/Saddleback
Brad Palumbo, Phoenix Analysis & Design
Bradley Ruprecht, US Army
Scott Schermer, S.C. Johnson
Thomas Starr, University of Louisville
Sean Wise, RePliForm
Michael Zerbe, Newell Rubbermaid
Bret Bordner, Laser Reproductions
Mike Connor, Integra
Kevin Dyer, InterPro
Bob Dzugan, buyCASTINGS
Fred Hilbrandt, FBI
Bill Lamey, Boeing
John Schaefer, DSM Somos
Greg Stein, Northrop Grumman
XuXiaoshu, Farsoon Hi-Tech
Arnold Zieger, Dalimer
Ron Belknap, Protocam
Jerry Bordner, Laser Reproductions
Dr. Dave Bourell, Univesity of Texas
ShekuKamara, MSOE
Kevin McAlea, 3D Systems
Bruce Okkema, Eagle Design & Technology
Lance Shanklin, Integra Support
Neil Hopkinson, Loughborough University
Dr. Paul Jacobs, 3D Systems
Harold Luper, Huntsman
Steve McDonald, L3
Dave Rosen, Georgia Tech
Richard Smeenk, Agile Manufacturing
Graham Tromans, Loughborough University
Mark Abshire, DSM
Denny Black, Valeo Sylvania
Chris Huskamp, The Boeing Phantom Works
SteinarKilli, Oslo School
Troy Kuhn, Chrysler
Glideon Levy, University of Applied Sciences
Ariel Lijenstein, Robtec
Jan Richter, Solid Concepts
Rick Booth, Advanced Laser Materials
Carl Dekker, Met-L-Flo
Kent Firestone, Solid Concepts
Gary Graf, University of Louisville
Bruce LeMaster, Applied Rapid Technologies
Tom Mueller, Express Pattern
Gary Rabinovitz, Reebok International
Lawrence Winnen, Tyco Electronics
Joe Allison, Solid Concepts
Daniel Baker, US Army Benet Labs
Philip Conner, 3D Systems
Renee Flynn, Paramount Industries
SoerenGriessbavh, V.G. Kunstsofftechni
Terry Kreplin, Baxter
R.J. Robinson, University of Kentucky
IgataTersuzo, INCS
Georgia Theriot, GT Signiture
James Williams, Paramount Industries
Gregg Banyon, Delphi
Martin Colombo, ATI
Richard Davis, Motorola
Ken Davis, University of Louisville
Al DeWitt, Rapid Solutions
Mike Scanlon, Homes Group
Roger Speilman, Solid Concepts
Brent Stucker, Utah State
Scott Turner, Scicon
Rethia Williams, RMB Products
Kevin Ayers, FBI
Tim Gornet, University of Louisville
David Leigh, Harvest Technologies
Jeff Smith, Moeller Design
Derrick Spaven, RPM Solutions
Bob Speer, ALCOA
Scott Sutterer, DSM Somos
Bob Zubrickie, Tyco Electronics
Joe Allison, Solid Concepts
Phill Dickens, Loughborough University
Judy Gill, Raytheon
Mark Horner, The Technology House
Steve Deak, Hasbro
Beth Israelnaim, Becton-Dickenson
Kevin Kennedy, Prototech Engineering
Tom Sorovetz, Daimler Chrysler
Dave Flynn, Express Pattern
Elaine Hunt, Clemson University
Graham Tromans, Rover Group
Doug Van Putte, Eastman Kodak
Guy Bourdeau, Beckman Coulter
Rob Connelly, Becton-Dickinson
Joe DeGuglielmo, Eastman Kodak
Chuck Hull, 3D Systems
John Mack, General Motors
Fred Steinbauer, Pratt & Whitney
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